ON-GOING

  • 1High-Reliability Silicon Bridge Heterogeneous Packaging Technology for High-Efficiency Power Distribution

Ministry of Science and ICT, 2023~2025

(실리콘 브릿지 이종집적 패키징기술 개발, 저전력 반도체 시스템 구현을 위한 배선 구조 디자인 및 공정 개발, 등)

  • 1Hybrid-Bonding Technologies for 3D Package Interconnects

Ministry of Trade, Industry and Energy, 2023~2027

(­ 하이브리드 본딩 메커니즘 규명, ­ 신호전달 특성 분석, 등)

  • 1High-Density Low-Power Nonvolatile 3D Vertical Charge-Trap Synapse Array and Architecture Developments for On-Chip Learning

Ministry of Science and ICT, 2023~2025

(플래시 메모리 기반 SNN H/W flatform 설계, 온칩 학습, 등)

  • 1Emerging Non-Volatile Memories and their Applications

Samsung Electronics, 2020~2025

(TCAM/STT-MRAM/ReRAM core, peri circuit 설계, 등)

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